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Industrial Adhesives

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HH-2612

1:1 low-viscosity addition silicone, room/heat cure
Encapsulate IC chips, power energy modules; serve as shock-absorbing buffer material for precision mechanical assemblies, provides long-term moisture & vibration protection.
Ultra clear
Color
A:800-1200 B:600-1000
Viscosity(mPa⋅s)
-
Temperature(℃)
Description
SUITIT HH-2612 is low-viscosity two-component platinum addition silicone potting gel. It crosslinks into soft elastic rubber at ambient temperature or under heating. No volatile byproducts are generated during curing, delivering outstanding flexibility, shock absorption and moisture barrier performance to safeguard delicate electronic systems.
Features
  • Simple 1:1 weight mixing ratio for easy operation
  • Ultra-low viscosity with superior fluidity for smooth pouring
  • Dual curing options: room temperature cure or heat acceleration
  • Soft elastic structure absorbs vibration and mechanical impact
  • Zero curing byproducts, non-corrosive to all electronic parts
  • Premium comprehensive electrical insulation performance
  • Stable performance under extreme temperature fluctuations
Specification
Uncured Properties
ItemPart APart BMixed System
AppearanceClear liquidClear liquidClear liquid
Viscosity (mPas)800–1200600–1000700–1100
Specific Gravity (g/ml)0.95–1.000.95–1.00-
Mix Ratio (Weight)1:1
Pot Life (min, 25℃)60–120
Cured Properties (30 mins @80℃)
  • Cured Appearance: Colorless transparent gel
  • Penetration Hardness: 80–120
  • Thermal Conductivity: 0.17 W/mk
  • Volume Resistivity: 1.8×10¹⁵ Ω·cm
  • Dielectric Strength: 23 KV/mm
  • Dielectric Constant: 2.7
  • Dissipation Factor: 0.001
Important Operation Note
Substrates containing sulfur, nitrogen, organometallic or phosphorus compounds will inhibit curing. Clean and fully dry all components and test material compatibility before mass production.
Storage & Packaging
  • Storage Condition: Sealed original container ≤25℃
  • Shelf Life: 12 months from production date
  • Standard Sizes: 1L bottle, 20kg drum
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