Electronics Industry
Adhesive Solutions
High-strength, weather-resistant glue tailored to your production process
Tired Of These Bonding Troubles?
Overview
Electronic manufacturing relies on adhesives for bonding, sealing, potting and thermal conduction. Miniaturized devices, precise components and strict environmental rules demand adhesives with insulation, heat dissipation, low VOC and anti-aging properties to stabilize electronic performance.
Applications
Pain Points
Micro gaps cause glue overflow and short circuits; temperature cycling leads to yellowing and delamination.
Selection Standard
Low viscosity, high insulation, anti-yellowing, RoHS compliant.
Adhesive Type
UV curable adhesive
Pain Points
Chip heat accumulation; tiny bonding area with high insulation demand.
Selection Standard
Thermal conductivity, low shrinkage, fine filling performance.
Adhesive Type
Thermal conductive epoxy adhesive
Pain Points
Thermal expansion mismatch; moisture penetration risk during long operation.
Selection Standard
Waterproof insulation, flame retardant, buffer deformation.
Adhesive Type
Two-component PU potting adhesive
Pain Points
Low surface energy plastic weak bonding; aging from damp and heat.
Selection Standard
Direct adhesion to polyolefin, damp-heat resistance.
Adhesive Type
MS modified silane adhesive
Pain Points
Vibration loosening; liquid erosion causes circuit failure.
Selection Standard
Flexible sealing, chemical resistance, low odor.
Adhesive Type
Single-component silicone sealant
Pain Points
Light refraction issue; UV exposure causes yellowing.
Selection Standard
High light transmittance, weather resistance, no bubble.
Adhesive Type
Optical clear adhesive
Solutions
Clear Filters
FAQs
Thermally conductive epoxy adhesives are recommended, featuring low shrinkage and stable insulation under long-term heat cycling.
MS modified silane adhesives offer direct adhesion to low-surface-energy plastics with excellent damp-heat aging resistance.
Choose low-viscosity UV curable adhesives with precise dispensing matching micro-gap assembly requirements.
Multiple curing speed options available. Fast-curing grades fit high-speed automated dispensing to boost production efficiency.
Yes, OEM & ODM customization is available. We adjust viscosity, curing speed and hardness to match local assembly line processes and vehicle component requirements.
