Industrial Adhesives
Your Trusted OEM/ODM Partner for Certified, High-Performance Industrial Adhesives.
HH-5631
Low shrinkage two-component addition silicone potting gel
For potting and encapsulation of electronic components, offering protection against thermal shock, vibration, humidity, ozone, dust and chemicals. Widely used in high-voltage transformers, power converters, charging piles, automotive electronics, new energy power supplies, controllers and LED display modules.
A:Red B:White
Color
3000–6000
Viscosity(mPa⋅s)
-50-200
Temperature(℃)
Description
SUITIT HH-5631 is a two-component room-temperature vulcanized silicone gel designed for potting and encapsulation of electronic devices, especially suitable for applications requiring high flame retardancy. It adopts a convenient 1:1 volume mixing ratio with good flowability to penetrate complex structures, curing without heat release and low shrinkage to form elastic, non-powdering protective layers.
Features
- Convenient 1:1 volume mixing ratio, compatible with automatic dispensing equipment and manual operation
- Excellent flowability, easily fills intricate structural gaps
- Heating can greatly shorten curing cycle
- Cures in deep layers or post-assembly structures, non-exothermic with low shrinkage rate
- High elasticity after full cure, no cracking or powder shedding
- Wide temperature resistance range: -50 ~ 200℃
- Flame retardant performance meets UL94 V-0 standard
Specification
Uncured Properties
| Item | Part A | Part B |
|---|---|---|
| Appearance | Red fluid | White fluid |
| Curing Mechanism | Addition reaction | Addition reaction |
| Specific Gravity (25℃) | 1.65–1.75 g/ml | 1.55–1.65 g/ml |
| Brookfield Viscosity (20rpm, 25℃) | 3000–6000 mPas | 3000–6000 mPas |
| Volume Mix Ratio | 1 | 1 |
| Weight Mix Ratio | 1 | 0.93 |
| Working Time (25℃) | 60–120 min | — |
| Mixed Viscosity | 3000–6000 cps | — |
Curing Cycle
- Cure Time at 25℃: 3–6 h
- Cure Time at 80℃: 20–30 min
Cured Properties (80℃ × 30min Cure)
- Color: Pink
- Hardness (Shore A): 20–50
- Tensile Strength: ≥0.7 MPa
- Elongation at Break: ≥150 %
- Coefficient of Thermal Expansion (CTE): 239 ppm/K
- Dielectric Strength: ≥20 KV/mm
- Dielectric Constant (10KHz): 4.0
- Volume Resistivity: 1×10¹³ Ω·cm
- Thermal Conductivity: ≥1.0 W/mk
Storage & Shelf Life
Store in original sealed packaging at ≤25℃. Shelf life: 12 months from production date.
Packaging Specifications
- Part A: 25kg per drum
- Part B: 24kg per drum
Download
Similar Application
Clear Filters
Potting & Sealing
Strong flame retardancy mix addition silicone potting gel with good elasticity after curing
Potting & Sealing
High flame retardancy and heat-accelerated curing mix addition silicone potting gel
Potting & Sealing
Low shrinkage and heat-accelerated curing addition-type silicone potting gel
Potting & Sealing
dual UV & moisture cure deacidified silicone adhesive with flexible bonding layer
Potting & Sealing
Fluorescent dual UV & moisture cure alkoxy silicone adhesive with impact absorption
Potting & Sealing
UV & moisture dual-cure alkoxy silicone adhesive with shock/vibration absorption
