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HH-5633
Low shrinkage and heat-accelerated curing addition-type silicone potting gel
Suitable as production-line potting material to protect electronic parts against thermal shock, vibration, humidity, ozone, dust and chemical reagents. Widely used for high-voltage transformers, voltage stabilizers, power converters, charging piles, automotive electronics, new energy power supplies, controllers and LED display modules.
A:Red B:White
Color
3000–6000
Viscosity(mPa⋅s)
-50-200
Temperature(℃)
Description
SUITIT HH-5633 is a two-component room-temperature vulcanized silicone gel, specially developed for potting and encapsulation of electronic devices requiring high flame retardancy. It adopts a user-friendly 1:1 volume mixing ratio with good fluidity for filling complex structures; it cures without heat generation and low shrinkage, forming elastic protective layers after curing.
Features
- Convenient 1:1 volume mixing ratio, compatible with automatic dispensing equipment and manual operation
- Superior flowability to easily penetrate intricate internal structures
- Heating treatment can significantly speed up curing progress
- Supports deep-layer curing or post-assembly in-situ curing, non-exothermic with low shrinkage rate
- Excellent elasticity after curing, free of brittleness and powder shedding
- Wide working temperature range: -50 ~ 200℃
- Flame retardant performance reaches UL94 V-0 grade
Specification
Uncured Properties
| Test Item | Part A | Part B |
|---|---|---|
| Appearance | Fluid | Fluid |
| Color | Red | White |
| Curing Type | Addition reaction | Addition reaction |
| Specific Gravity (25℃) | 1.65–1.75 g/ml | 1.55–1.65 g/ml |
| Brookfield Viscosity (20rpm, 25℃) | 3000–6000 mPas | 3000–6000 mPas |
| Volume Mix Ratio | 1 | 1 |
| Weight Mix Ratio | 1 | 0.93 |
| Working Time (25℃) | 60–120 min | - |
| Mixed Viscosity | 3000–6000 cps | - |
Curing Cycle
- Complete Cure Time at 25℃: 3–6 h
- Accelerated Cure Time at 80℃: 20–30 min
Cured Properties (Cured at 80℃ for 30min)
- Cured Color: Pink
- Hardness (Shore A): 20–50
- Tensile Strength: ≥0.7 MPa
- Elongation at Break: ≥150 %
- Coefficient of Thermal Expansion (CTE): 239 ppm/K
- Dielectric Strength: ≥20 KV/mm
- Dielectric Constant (10KHz): 4.0
- Volume Resistivity: 1×10¹³ Ω·cm
- Thermal Conductivity: ≥1.0 W/mk
Storage & Shelf Life
Store in original sealed packaging under ≤25℃. Shelf life: 12 months starting from production date.
Packaging Specifications
- Component A: 25kg per drum
- Component B: 24kg per drum
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