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Industrial Adhesives

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HH-5633

Low shrinkage and heat-accelerated curing addition-type silicone potting gel
Suitable as production-line potting material to protect electronic parts against thermal shock, vibration, humidity, ozone, dust and chemical reagents. Widely used for high-voltage transformers, voltage stabilizers, power converters, charging piles, automotive electronics, new energy power supplies, controllers and LED display modules.
A:Red B:White
Color
3000–6000
Viscosity(mPa⋅s)
-50-200
Temperature(℃)
Description
SUITIT HH-5633 is a two-component room-temperature vulcanized silicone gel, specially developed for potting and encapsulation of electronic devices requiring high flame retardancy. It adopts a user-friendly 1:1 volume mixing ratio with good fluidity for filling complex structures; it cures without heat generation and low shrinkage, forming elastic protective layers after curing.
Features
  • Convenient 1:1 volume mixing ratio, compatible with automatic dispensing equipment and manual operation
  • Superior flowability to easily penetrate intricate internal structures
  • Heating treatment can significantly speed up curing progress
  • Supports deep-layer curing or post-assembly in-situ curing, non-exothermic with low shrinkage rate
  • Excellent elasticity after curing, free of brittleness and powder shedding
  • Wide working temperature range: -50 ~ 200℃
  • Flame retardant performance reaches UL94 V-0 grade
Specification
Uncured Properties
Test ItemPart APart B
AppearanceFluidFluid
ColorRedWhite
Curing TypeAddition reactionAddition reaction
Specific Gravity (25℃)1.65–1.75 g/ml1.55–1.65 g/ml
Brookfield Viscosity (20rpm, 25℃)3000–6000 mPas3000–6000 mPas
Volume Mix Ratio11
Weight Mix Ratio10.93
Working Time (25℃)60–120 min-
Mixed Viscosity3000–6000 cps-
Curing Cycle
  • Complete Cure Time at 25℃: 3–6 h
  • Accelerated Cure Time at 80℃: 20–30 min
Cured Properties (Cured at 80℃ for 30min)
  • Cured Color: Pink
  • Hardness (Shore A): 20–50
  • Tensile Strength: ≥0.7 MPa
  • Elongation at Break: ≥150 %
  • Coefficient of Thermal Expansion (CTE): 239 ppm/K
  • Dielectric Strength: ≥20 KV/mm
  • Dielectric Constant (10KHz): 4.0
  • Volume Resistivity: 1×10¹³ Ω·cm
  • Thermal Conductivity: ≥1.0 W/mk
Storage & Shelf Life
Store in original sealed packaging under ≤25℃. Shelf life: 12 months starting from production date.
Packaging Specifications
  • Component A: 25kg per drum
  • Component B: 24kg per drum
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