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HH-7855
Non-sagging single-part heat curable silicone with high temperature resistance
Bonding & sealing of high-temperature components such as oven, induction cooker and microwave panels. CIPG in-situ forming repair silicone gaskets. Sealing of high-temperature pipes and flanges.Bonding & sealing for other long-term high-temperature working areas. Adhesion of semiconductor wafer dicing trays
Translucent
Color
Paste
Viscosity(mPa⋅s)
-60-280
Temperature(℃)
Description
SUITIT HH-7855 is a single-component non-sagging addition silicone that cures rapidly under heating to form elastic silicone rubber. It is developed for bonding and sealing scenarios requiring high temperature resistance, featuring excellent adhesion to various substrates including metal, glass, plastic and ceramic, with maximum heat resistance reaching 280℃.
Features
- Single-part non-sagging paste, fast curing upon heating
- Reliable adhesion to multiple substrates without primer coating
- Wide temperature tolerance: -60℃ ~ 280℃
- Compliant with CIPG in-situ forming technology requirements
Specification
Uncured Properties
- Appearance: Non-sagging paste
- Color: Translucent
- Curing Type: Heat curing
- Specific Gravity (25℃): 1.05–1.10 g/ml
Heat Curing Schedule
- 80℃ curing time: 30–60 min
- 100℃ curing time: 20–30 min
- 150℃ curing time: 5–10 min
Cured Properties
- Hardness (Shore A): 30–40
- Tensile Strength: ≥4.0 MPa
- Elongation at Break: ≥500 %
- Shear Strength (Aluminum/Aluminum): ≥5.0 kgf/cm²
- Permanent Compression Set (Room Temp): ≤1 %
- Permanent Compression Set (150℃): ≤10 %
- Dielectric Strength: 21 KV/mm
- Dielectric Constant (1 MHz): 4.5
- Volume Resistivity: 1.8×10¹⁵ Ω·cm
Storage & Shelf Life
Store in original sealed packaging at ≤25℃. Shelf life: 6 months starting from production date.
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