Industrial Adhesives
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HH-9360NC
Low-odor two-part non-corrosive epoxy cures,premium insulation & solvent resistance
Potting, encapsulation and bonding of corrosion-sensitive electrical & electronic parts for automotive and aerospace industries; ideal for PCB component mounting and equipment housing encapsulation with full circuit protection.
A:Black B:Light yellow
Color
A：5000-8000 B:10000-13000
Viscosity(mPa⋅s)
-50-120
Temperature(℃)
Description
SUITIT HH-9360NC is industrial two-component epoxy potting adhesive made of modified bisphenol A resin, fillers and modified amine hardener. It features non-corrosive formula, dual curing modes, outstanding chemical resistance, stable mechanical strength and superior electrical insulation to shield fragile electronic assemblies.
Features
- Dual curing options: room-temperature cure or fast heat acceleration
- Low-odor solvent-free formula without harmful volatile substances
- Excellent high-performance electrical insulating properties
- Broad resistance to various industrial chemicals and solvents
- Wide service temperature window from -50℃ to 120℃, stable under 100℃ long-term exposure
- Non-corrosive formula safe for delicate, corrosion-prone electronic components
Specification
Curing Parameters
- Gel Time (100℃): 2–5 mins
- Full Cure Cycle: 24 hours @ 25℃; 3 hours @ 60℃
Cured Mechanical Performance
- Shore D Hardness: 75–85
- Tensile Strength: ≥30 MPa
- Elongation at Break: ≥5%
- Steel Shear Strength: ≥30 MPa
- Aluminum Shear Strength: ≥20 MPa
- PC/ABS Shear Strength: ≥10 MPa
Thermal & Moisture Performance
- Glass Transition Temperature (Tg): 65–75℃
- Water Absorption (25℃, 24h): ≤0.15%
Electrical Properties (25℃)
- Dielectric Constant (1MHz): 2.9
- Dielectric Strength: ≥20 KV/mm
- Volume Resistivity: 3 × 10¹⁵ Ω·cm
Storage & Packaging
- Storage Condition: Sealed original packaging, stored below 25℃
- Shelf Life: 12 months counted from production date
- Standard Sizes: 50ml cartridge, 400ml cartridge; customized packages available
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